JPH0463131U - - Google Patents
Info
- Publication number
- JPH0463131U JPH0463131U JP10478790U JP10478790U JPH0463131U JP H0463131 U JPH0463131 U JP H0463131U JP 10478790 U JP10478790 U JP 10478790U JP 10478790 U JP10478790 U JP 10478790U JP H0463131 U JPH0463131 U JP H0463131U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- hereinafter referred
- semiconductor element
- tool
- finger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims 1
- 230000007547 defect Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10478790U JPH0463131U (en]) | 1990-10-04 | 1990-10-04 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10478790U JPH0463131U (en]) | 1990-10-04 | 1990-10-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0463131U true JPH0463131U (en]) | 1992-05-29 |
Family
ID=31850205
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10478790U Pending JPH0463131U (en]) | 1990-10-04 | 1990-10-04 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0463131U (en]) |
-
1990
- 1990-10-04 JP JP10478790U patent/JPH0463131U/ja active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5933642U (ja) | 感圧素子 | |
JPH0463131U (en]) | ||
JPH0213320U (en]) | ||
JPS6331559U (en]) | ||
JPS63288029A (ja) | 樹脂封止型半導体装置 | |
JPH0363929U (en]) | ||
JPH08306744A (ja) | 電子部品 | |
JPS6237935U (en]) | ||
JPH0444733U (en]) | ||
JPH03124641U (en]) | ||
JPS6242254U (en]) | ||
JPS6196901U (en]) | ||
JPH0364057A (ja) | リードフレーム | |
JPH01165638U (en]) | ||
JPH02103999U (en]) | ||
JPH0247841A (ja) | 半導体装置の製造方法 | |
JPS63177043U (en]) | ||
JPH0165134U (en]) | ||
JPS59169127U (ja) | 弾性表面波装置 | |
JPS59189325U (ja) | 機械振動子 | |
JPH0324799U (en]) | ||
JPS6251749U (en]) | ||
JPH0220335U (en]) | ||
JPS633148U (en]) | ||
JPS60109228U (ja) | 加圧スイツチ |